Impact of pre-existing voids on electromigration in copper interconnects

• Main Authors: Mario, Hendro, Lim, Meng Keong, Gan, Chee Lip
• Other Authors: School of Materials Science & Engineering
• Format: Conference or Workshop Item
• Language: English
• Published: 2013
• Online Access: https://hdl.handle.net/10356/98226; http://hdl.handle.net/10220/12313
• Institution: Nanyang Technological University

Previous in-situ electromigration experiments on copper interconnect have shown voids drifting towards the cathode, instead of nucleating at the cathode end. These voids could have pre-existed in the line before stressing and drifted towards the cathode. Furthermore, fatal voids observed from failur...