Impact of pre-existing voids on electromigration in copper interconnects
Previous in-situ electromigration experiments on copper interconnect have shown voids drifting towards the cathode, instead of nucleating at the cathode end. These voids could have pre-existed in the line before stressing and drifted towards the cathode. Furthermore, fatal voids observed from failur...
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| Main Authors: | , , |
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| 格式: | Conference or Workshop Item |
| 語言: | English |
| 出版: |
2013
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| 在線閱讀: | https://hdl.handle.net/10356/98226 http://hdl.handle.net/10220/12313 |
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| 機構: | Nanyang Technological University |
| 語言: | English |