Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding
Two low-temperature wafer bonding methods, namely the medium-vacuum level wafer bonding (MVWB) and plasma-activated wafer bonding (PAWB), are performed. After low-temperature annealing(500°C) for a short time (<5h) , the bond strength of these two low-temperature methods is improved as compared...
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| Main Authors: | , , |
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| 格式: | Article |
| 語言: | English |
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2013
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| 在線閱讀: | https://hdl.handle.net/10356/98498 http://hdl.handle.net/10220/17368 |
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