Correspondence: Effects of deliberate copper contamination from the plating solution on the electrical characteristics of MOSFETs

10.1109/66.920729

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Bibliographic Details
Main Authors:	Tee, K.C., Prasad, K., Lee, C.S., Gong, H., Cha, C.L., Chan, L., See, A.K.
Other Authors:	MATERIALS SCIENCE
Format:	Article
Published:	2014
Subjects:	Contamination Copper MOSFET Silicon
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/106993
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Institution:	National University of Singapore

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spelling	sg-nus-scholar.10635-1069932023-10-26T09:43:09Z Correspondence: Effects of deliberate copper contamination from the plating solution on the electrical characteristics of MOSFETs Tee, K.C. Prasad, K. Lee, C.S. Gong, H. Cha, C.L. Chan, L. See, A.K. MATERIALS SCIENCE Contamination Copper MOSFET Silicon 10.1109/66.920729 IEEE Transactions on Semiconductor Manufacturing 14 2 170-172 ITSME 2014-10-29T08:38:01Z 2014-10-29T08:38:01Z 2001-05 Article Tee, K.C., Prasad, K., Lee, C.S., Gong, H., Cha, C.L., Chan, L., See, A.K. (2001-05). Correspondence: Effects of deliberate copper contamination from the plating solution on the electrical characteristics of MOSFETs. IEEE Transactions on Semiconductor Manufacturing 14 (2) : 170-172. ScholarBank@NUS Repository. https://doi.org/10.1109/66.920729 08946507 http://scholarbank.nus.edu.sg/handle/10635/106993 000168502900009 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Contamination Copper MOSFET Silicon
spellingShingle	Contamination Copper MOSFET Silicon Tee, K.C. Prasad, K. Lee, C.S. Gong, H. Cha, C.L. Chan, L. See, A.K. Correspondence: Effects of deliberate copper contamination from the plating solution on the electrical characteristics of MOSFETs
description	10.1109/66.920729
author2	MATERIALS SCIENCE
author_facet	MATERIALS SCIENCE Tee, K.C. Prasad, K. Lee, C.S. Gong, H. Cha, C.L. Chan, L. See, A.K.
format	Article
author	Tee, K.C. Prasad, K. Lee, C.S. Gong, H. Cha, C.L. Chan, L. See, A.K.
author_sort	Tee, K.C.
title	Correspondence: Effects of deliberate copper contamination from the plating solution on the electrical characteristics of MOSFETs
title_short	Correspondence: Effects of deliberate copper contamination from the plating solution on the electrical characteristics of MOSFETs
title_full	Correspondence: Effects of deliberate copper contamination from the plating solution on the electrical characteristics of MOSFETs
title_fullStr	Correspondence: Effects of deliberate copper contamination from the plating solution on the electrical characteristics of MOSFETs
title_full_unstemmed	Correspondence: Effects of deliberate copper contamination from the plating solution on the electrical characteristics of MOSFETs
title_sort	correspondence: effects of deliberate copper contamination from the plating solution on the electrical characteristics of mosfets
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/106993
_version_	1781788318877351936

Correspondence: Effects of deliberate copper contamination from the plating solution on the electrical characteristics of MOSFETs

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