Evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process

10.1088/0268-1242/17/9/302

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Main Authors: Lu, H., Kang, C.L., Wong, S.C.K., Gong, H.
Other Authors: MATERIALS SCIENCE
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/107031
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-1070312023-10-29T21:33:41Z Evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process Lu, H. Kang, C.L. Wong, S.C.K. Gong, H. MATERIALS SCIENCE 10.1088/0268-1242/17/9/302 Semiconductor Science and Technology 17 9 911-917 SSTEE 2014-10-29T08:38:31Z 2014-10-29T08:38:31Z 2002-09 Article Lu, H., Kang, C.L., Wong, S.C.K., Gong, H. (2002-09). Evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process. Semiconductor Science and Technology 17 (9) : 911-917. ScholarBank@NUS Repository. https://doi.org/10.1088/0268-1242/17/9/302 02681242 http://scholarbank.nus.edu.sg/handle/10635/107031 000178307600005 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
description 10.1088/0268-1242/17/9/302
author2 MATERIALS SCIENCE
author_facet MATERIALS SCIENCE
Lu, H.
Kang, C.L.
Wong, S.C.K.
Gong, H.
format Article
author Lu, H.
Kang, C.L.
Wong, S.C.K.
Gong, H.
spellingShingle Lu, H.
Kang, C.L.
Wong, S.C.K.
Gong, H.
Evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process
author_sort Lu, H.
title Evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process
title_short Evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process
title_full Evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process
title_fullStr Evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process
title_full_unstemmed Evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process
title_sort evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/107031
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