Evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process
10.1088/0268-1242/17/9/302
Saved in:
Main Authors: | , , , |
---|---|
Other Authors: | |
Format: | Article |
Published: |
2014
|
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/107031 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
id |
sg-nus-scholar.10635-107031 |
---|---|
record_format |
dspace |
spelling |
sg-nus-scholar.10635-1070312023-10-29T21:33:41Z Evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process Lu, H. Kang, C.L. Wong, S.C.K. Gong, H. MATERIALS SCIENCE 10.1088/0268-1242/17/9/302 Semiconductor Science and Technology 17 9 911-917 SSTEE 2014-10-29T08:38:31Z 2014-10-29T08:38:31Z 2002-09 Article Lu, H., Kang, C.L., Wong, S.C.K., Gong, H. (2002-09). Evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process. Semiconductor Science and Technology 17 (9) : 911-917. ScholarBank@NUS Repository. https://doi.org/10.1088/0268-1242/17/9/302 02681242 http://scholarbank.nus.edu.sg/handle/10635/107031 000178307600005 Scopus |
institution |
National University of Singapore |
building |
NUS Library |
continent |
Asia |
country |
Singapore Singapore |
content_provider |
NUS Library |
collection |
ScholarBank@NUS |
description |
10.1088/0268-1242/17/9/302 |
author2 |
MATERIALS SCIENCE |
author_facet |
MATERIALS SCIENCE Lu, H. Kang, C.L. Wong, S.C.K. Gong, H. |
format |
Article |
author |
Lu, H. Kang, C.L. Wong, S.C.K. Gong, H. |
spellingShingle |
Lu, H. Kang, C.L. Wong, S.C.K. Gong, H. Evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process |
author_sort |
Lu, H. |
title |
Evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process |
title_short |
Evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process |
title_full |
Evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process |
title_fullStr |
Evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process |
title_full_unstemmed |
Evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process |
title_sort |
evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process |
publishDate |
2014 |
url |
http://scholarbank.nus.edu.sg/handle/10635/107031 |
_version_ |
1781788326475333632 |