Evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process

10.1088/0268-1242/17/9/302

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Bibliographic Details
Main Authors:	Lu, H., Kang, C.L., Wong, S.C.K., Gong, H.
Other Authors:	MATERIALS SCIENCE
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/107031
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Institution:	National University of Singapore

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