Simulation of the impact of climate change on the current building's residential envelope thermal transfer value (ETTV) regulation in Singapore

10.1061/41204(426)5

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Bibliographic Details
Main Authors:	Wong, N.H., Jusuf, S.K., Syafii, N.I., Li, W.H., Tan, A.Y.K.
Other Authors:	DEAN'S OFFICE (SCHOOL OF DESIGN & ENV)
Format:	Conference or Workshop Item
Published:	2014
Subjects:	Building envelope Climate change Residential buildings Simulation Singapore
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/114091
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-114091
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spelling	sg-nus-scholar.10635-1140912015-01-12T17:02:43Z Simulation of the impact of climate change on the current building's residential envelope thermal transfer value (ETTV) regulation in Singapore Wong, N.H. Jusuf, S.K. Syafii, N.I. Li, W.H. Tan, A.Y.K. DEAN'S OFFICE (SCHOOL OF DESIGN & ENV) BUILDING Building envelope Climate change Residential buildings Simulation Singapore 10.1061/41204(426)5 ICSDC 2011: Integrating Sustainability Practices in the Construction Industry - Proceedings of the International Conference on Sustainable Design and Construction 2011 34-42 2014-12-01T08:24:30Z 2014-12-01T08:24:30Z 2012 Conference Paper Wong, N.H.,Jusuf, S.K.,Syafii, N.I.,Li, W.H.,Tan, A.Y.K. (2012). Simulation of the impact of climate change on the current building's residential envelope thermal transfer value (ETTV) regulation in Singapore. ICSDC 2011: Integrating Sustainability Practices in the Construction Industry - Proceedings of the International Conference on Sustainable Design and Construction 2011 : 34-42. ScholarBank@NUS Repository. <a href="https://doi.org/10.1061/41204(426)5" target="_blank">https://doi.org/10.1061/41204(426)5</a> 9780784412046 http://scholarbank.nus.edu.sg/handle/10635/114091 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
topic	Building envelope Climate change Residential buildings Simulation Singapore
spellingShingle	Building envelope Climate change Residential buildings Simulation Singapore Wong, N.H. Jusuf, S.K. Syafii, N.I. Li, W.H. Tan, A.Y.K. Simulation of the impact of climate change on the current building's residential envelope thermal transfer value (ETTV) regulation in Singapore
description	10.1061/41204(426)5
author2	DEAN'S OFFICE (SCHOOL OF DESIGN & ENV)
author_facet	DEAN'S OFFICE (SCHOOL OF DESIGN & ENV) Wong, N.H. Jusuf, S.K. Syafii, N.I. Li, W.H. Tan, A.Y.K.
format	Conference or Workshop Item
author	Wong, N.H. Jusuf, S.K. Syafii, N.I. Li, W.H. Tan, A.Y.K.
author_sort	Wong, N.H.
title	Simulation of the impact of climate change on the current building's residential envelope thermal transfer value (ETTV) regulation in Singapore
title_short	Simulation of the impact of climate change on the current building's residential envelope thermal transfer value (ETTV) regulation in Singapore
title_full	Simulation of the impact of climate change on the current building's residential envelope thermal transfer value (ETTV) regulation in Singapore
title_fullStr	Simulation of the impact of climate change on the current building's residential envelope thermal transfer value (ETTV) regulation in Singapore
title_full_unstemmed	Simulation of the impact of climate change on the current building's residential envelope thermal transfer value (ETTV) regulation in Singapore
title_sort	simulation of the impact of climate change on the current building's residential envelope thermal transfer value (ettv) regulation in singapore
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/114091
_version_	1681094775335288832

Simulation of the impact of climate change on the current building's residential envelope thermal transfer value (ETTV) regulation in Singapore

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