Simulation of the impact of climate change on the current building's residential envelope thermal transfer value (ETTV) regulation in Singapore
10.1061/41204(426)5
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Main Authors: | Wong, N.H., Jusuf, S.K., Syafii, N.I., Li, W.H., Tan, A.Y.K. |
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Other Authors: | DEAN'S OFFICE (SCHOOL OF DESIGN & ENV) |
Format: | Conference or Workshop Item |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/114091 |
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Institution: | National University of Singapore |
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