Simulation of the impact of climate change on the current building's residential envelope thermal transfer value (ETTV) regulation in Singapore

10.1061/41204(426)5

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Bibliographic Details
Main Authors: Wong, N.H., Jusuf, S.K., Syafii, N.I., Li, W.H., Tan, A.Y.K.
Other Authors: DEAN'S OFFICE (SCHOOL OF DESIGN & ENV)
Format: Conference or Workshop Item
Published: 2014
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/114091
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Institution: National University of Singapore

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