Simulation of the impact of climate change on the current building's residential envelope thermal transfer value (ETTV) regulation in Singapore

Simulation of the impact of climate change on the current building's residential envelope thermal transfer value (ETTV) regulation in Singapore

10.1061/41204(426)5

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Bibliographic Details
Main Authors: Wong, N.H., Jusuf, S.K., Syafii, N.I., Li, W.H., Tan, A.Y.K.
Other Authors: DEAN'S OFFICE (SCHOOL OF DESIGN & ENV)
Format: Conference or Workshop Item
Published: 2014
Subjects:
Building envelope
Climate change
Residential buildings
Simulation
Singapore
Online Access:http://scholarbank.nus.edu.sg/handle/10635/114091
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Institution: National University of Singapore
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