Simulation of the impact of climate change on the current building's residential envelope thermal transfer value (ETTV) regulation in Singapore

Simulation of the impact of climate change on the current building's residential envelope thermal transfer value (ETTV) regulation in Singapore

10.1061/41204(426)5

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書目詳細資料
Main Authors:	Wong, N.H., Jusuf, S.K., Syafii, N.I., Li, W.H., Tan, A.Y.K.
其他作者:	DEAN'S OFFICE (SCHOOL OF DESIGN & ENV)
格式:	Conference or Workshop Item
出版:	2014
主題:	Building envelope Climate change Residential buildings Simulation Singapore
在線閱讀:	http://scholarbank.nus.edu.sg/handle/10635/114091
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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