Simulation of the impact of climate change on the current building's residential envelope thermal transfer value (ETTV) regulation in Singapore

• Main Authors: Wong, N.H., Jusuf, S.K., Syafii, N.I., Li, W.H., Tan, A.Y.K.
• 其他作者: DEAN'S OFFICE (SCHOOL OF DESIGN & ENV)
• 格式: Conference or Workshop Item
• 出版: 2014
• 主題: Building envelope; Climate change; Residential buildings; Simulation; Singapore
• 在線閱讀: http://scholarbank.nus.edu.sg/handle/10635/114091

10.1061/41204(426)5