Design of packaged microstrip antennas using wirebonding technique

Design of packaged microstrip antennas using wirebonding technique

10.1080/0020721031000118806

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Bibliographic Details
Main Authors: Dou, W., Chia, Y.W.M.
Other Authors: INSTITUTE FOR COMMUNICATIONS RESEARCH
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/115670
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Institution: National University of Singapore
Description
Summary:10.1080/0020721031000118806

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