Design of packaged microstrip antennas using wirebonding technique
10.1080/0020721031000118806
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Main Authors: | Dou, W., Chia, Y.W.M. |
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Other Authors: | INSTITUTE FOR COMMUNICATIONS RESEARCH |
Format: | Article |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/115670 |
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Institution: | National University of Singapore |
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