FE IMPACTS ON SOLDER JOINT PROPERTIES IN MICROELECTRONIC ASSEMBLY

Master's

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Bibliographic Details
Main Author:	LIN YITENG
Other Authors:	PHYSICS
Format:	Theses and Dissertations
Language:	English
Published:	2015
Subjects:	solder joint, SnAgCu, Intermetallic Compound, reflow, aging,furnace melting
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/119713
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Institution:	National University of Singapore
Language:	English

Description
Summary:	Master's

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