FE IMPACTS ON SOLDER JOINT PROPERTIES IN MICROELECTRONIC ASSEMBLY
Master's
Saved in:
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Theses and Dissertations |
| Language: | English |
| Published: |
2015
|
| Subjects: | |
| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/119713 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | National University of Singapore |
| Language: | English |
| id |
sg-nus-scholar.10635-119713 |
|---|---|
| record_format |
dspace |
| spelling |
sg-nus-scholar.10635-1197132017-03-01T19:54:24Z FE IMPACTS ON SOLDER JOINT PROPERTIES IN MICROELECTRONIC ASSEMBLY LIN YITENG PHYSICS TOK ENG SOON RAMASWAMI, GOPALA KRISHNAN solder joint, SnAgCu, Intermetallic Compound, reflow, aging,furnace melting Master's MASTER OF SCIENCE 2015-05-26T18:00:08Z 2015-05-26T18:00:08Z 2014-09-01 Thesis LIN YITENG (2014-09-01). FE IMPACTS ON SOLDER JOINT PROPERTIES IN MICROELECTRONIC ASSEMBLY. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/119713 NOT_IN_WOS en |
| institution |
National University of Singapore |
| building |
NUS Library |
| country |
Singapore |
| collection |
ScholarBank@NUS |
| language |
English |
| topic |
solder joint, SnAgCu, Intermetallic Compound, reflow, aging,furnace melting |
| spellingShingle |
solder joint, SnAgCu, Intermetallic Compound, reflow, aging,furnace melting LIN YITENG FE IMPACTS ON SOLDER JOINT PROPERTIES IN MICROELECTRONIC ASSEMBLY |
| description |
Master's |
| author2 |
PHYSICS |
| author_facet |
PHYSICS LIN YITENG |
| format |
Theses and Dissertations |
| author |
LIN YITENG |
| author_sort |
LIN YITENG |
| title |
FE IMPACTS ON SOLDER JOINT PROPERTIES IN MICROELECTRONIC ASSEMBLY |
| title_short |
FE IMPACTS ON SOLDER JOINT PROPERTIES IN MICROELECTRONIC ASSEMBLY |
| title_full |
FE IMPACTS ON SOLDER JOINT PROPERTIES IN MICROELECTRONIC ASSEMBLY |
| title_fullStr |
FE IMPACTS ON SOLDER JOINT PROPERTIES IN MICROELECTRONIC ASSEMBLY |
| title_full_unstemmed |
FE IMPACTS ON SOLDER JOINT PROPERTIES IN MICROELECTRONIC ASSEMBLY |
| title_sort |
fe impacts on solder joint properties in microelectronic assembly |
| publishDate |
2015 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/119713 |
| _version_ |
1681095568971005952 |