3D simulation and fabrication of multiple-gate device
Master's
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sg-nus-scholar.10635-149822017-10-21T09:36:14Z 3D simulation and fabrication of multiple-gate device TEE KIAN MENG ELECTRICAL & COMPUTER ENGINEERING SAMUDRA, GANESH S SOI, corner rounding, multiple gate devices, FINFET, gate all around devices, pseudo 3D simulation Master's MASTER OF ENGINEERING 2010-04-08T10:48:52Z 2010-04-08T10:48:52Z 2005-09-13 Thesis TEE KIAN MENG (2005-09-13). 3D simulation and fabrication of multiple-gate device. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/14982 NOT_IN_WOS en |
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National University of Singapore |
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Singapore |
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ScholarBank@NUS |
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English |
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SOI, corner rounding, multiple gate devices, FINFET, gate all around devices, pseudo 3D simulation |
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SOI, corner rounding, multiple gate devices, FINFET, gate all around devices, pseudo 3D simulation TEE KIAN MENG 3D simulation and fabrication of multiple-gate device |
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Master's |
author2 |
ELECTRICAL & COMPUTER ENGINEERING |
author_facet |
ELECTRICAL & COMPUTER ENGINEERING TEE KIAN MENG |
format |
Theses and Dissertations |
author |
TEE KIAN MENG |
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TEE KIAN MENG |
title |
3D simulation and fabrication of multiple-gate device |
title_short |
3D simulation and fabrication of multiple-gate device |
title_full |
3D simulation and fabrication of multiple-gate device |
title_fullStr |
3D simulation and fabrication of multiple-gate device |
title_full_unstemmed |
3D simulation and fabrication of multiple-gate device |
title_sort |
3d simulation and fabrication of multiple-gate device |
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2010 |
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http://scholarbank.nus.edu.sg/handle/10635/14982 |
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