Die-to-Die Interconnect Studies using Copper Pillars with Tin-Silver Solder Bumps

Master's

Saved in:

Bibliographic Details
Main Author:	DAVID ALLEN WONG
Other Authors:	SINGAPORE-MIT ALLIANCE
Format:	Theses and Dissertations
Published:	2019
Subjects:	Copper pillar bumps oven reflow (attach and reflow) local reflow (thermocompression) no-clean flux
Online Access:	https://scholarbank.nus.edu.sg/handle/10635/153885
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	National University of Singapore

id	sg-nus-scholar.10635-153885
record_format	dspace
spelling	sg-nus-scholar.10635-1538852019-05-09T13:10:13Z Die-to-Die Interconnect Studies using Copper Pillars with Tin-Silver Solder Bumps DAVID ALLEN WONG SINGAPORE-MIT ALLIANCE Copper pillar bumps oven reflow (attach and reflow) local reflow (thermocompression) no-clean flux Master's MASTER OF SCIENCE IN ADVANCED MATERIALS FOR MICRO- & NANO- SYSTEMS 2019-05-09T04:10:23Z 2019-05-09T04:10:23Z 2010 Thesis DAVID ALLEN WONG (2010). Die-to-Die Interconnect Studies using Copper Pillars with Tin-Silver Solder Bumps. ScholarBank@NUS Repository. https://scholarbank.nus.edu.sg/handle/10635/153885 SMA BATCHLOAD 20190422
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
topic	Copper pillar bumps oven reflow (attach and reflow) local reflow (thermocompression) no-clean flux
spellingShingle	Copper pillar bumps oven reflow (attach and reflow) local reflow (thermocompression) no-clean flux DAVID ALLEN WONG Die-to-Die Interconnect Studies using Copper Pillars with Tin-Silver Solder Bumps
description	Master's
author2	SINGAPORE-MIT ALLIANCE
author_facet	SINGAPORE-MIT ALLIANCE DAVID ALLEN WONG
format	Theses and Dissertations
author	DAVID ALLEN WONG
author_sort	DAVID ALLEN WONG
title	Die-to-Die Interconnect Studies using Copper Pillars with Tin-Silver Solder Bumps
title_short	Die-to-Die Interconnect Studies using Copper Pillars with Tin-Silver Solder Bumps
title_full	Die-to-Die Interconnect Studies using Copper Pillars with Tin-Silver Solder Bumps
title_fullStr	Die-to-Die Interconnect Studies using Copper Pillars with Tin-Silver Solder Bumps
title_full_unstemmed	Die-to-Die Interconnect Studies using Copper Pillars with Tin-Silver Solder Bumps
title_sort	die-to-die interconnect studies using copper pillars with tin-silver solder bumps
publishDate	2019
url	https://scholarbank.nus.edu.sg/handle/10635/153885
_version_	1681099309820411904

Die-to-Die Interconnect Studies using Copper Pillars with Tin-Silver Solder Bumps

Similar Items