Die-to-Die Interconnect Studies using Copper Pillars with Tin-Silver Solder Bumps
Master's
محفوظ في:
| المؤلف الرئيسي: | |
|---|---|
| مؤلفون آخرون: | |
| التنسيق: | Theses and Dissertations |
| منشور في: |
2019
|
| الموضوعات: | |
| الوصول للمادة أونلاين: | https://scholarbank.nus.edu.sg/handle/10635/153885 |
| الوسوم: |
إضافة وسم
لا توجد وسوم, كن أول من يضع وسما على هذه التسجيلة!
|
| id |
sg-nus-scholar.10635-153885 |
|---|---|
| record_format |
dspace |
| spelling |
sg-nus-scholar.10635-1538852024-10-26T00:13:18Z Die-to-Die Interconnect Studies using Copper Pillars with Tin-Silver Solder Bumps DAVID ALLEN WONG SINGAPORE-MIT ALLIANCE Copper pillar bumps oven reflow (attach and reflow) local reflow (thermocompression) no-clean flux Master's MASTER OF SCIENCE IN ADVANCED MATERIALS FOR MICRO- & NANO- SYSTEMS 2019-05-09T04:10:23Z 2019-05-09T04:10:23Z 2010 Thesis DAVID ALLEN WONG (2010). Die-to-Die Interconnect Studies using Copper Pillars with Tin-Silver Solder Bumps. ScholarBank@NUS Repository. https://scholarbank.nus.edu.sg/handle/10635/153885 SMA BATCHLOAD 20190422 |
| institution |
National University of Singapore |
| building |
NUS Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NUS Library |
| collection |
ScholarBank@NUS |
| topic |
Copper pillar bumps oven reflow (attach and reflow) local reflow (thermocompression) no-clean flux |
| spellingShingle |
Copper pillar bumps oven reflow (attach and reflow) local reflow (thermocompression) no-clean flux DAVID ALLEN WONG Die-to-Die Interconnect Studies using Copper Pillars with Tin-Silver Solder Bumps |
| description |
Master's |
| author2 |
SINGAPORE-MIT ALLIANCE |
| author_facet |
SINGAPORE-MIT ALLIANCE DAVID ALLEN WONG |
| format |
Theses and Dissertations |
| author |
DAVID ALLEN WONG |
| author_sort |
DAVID ALLEN WONG |
| title |
Die-to-Die Interconnect Studies using Copper Pillars with Tin-Silver Solder Bumps |
| title_short |
Die-to-Die Interconnect Studies using Copper Pillars with Tin-Silver Solder Bumps |
| title_full |
Die-to-Die Interconnect Studies using Copper Pillars with Tin-Silver Solder Bumps |
| title_fullStr |
Die-to-Die Interconnect Studies using Copper Pillars with Tin-Silver Solder Bumps |
| title_full_unstemmed |
Die-to-Die Interconnect Studies using Copper Pillars with Tin-Silver Solder Bumps |
| title_sort |
die-to-die interconnect studies using copper pillars with tin-silver solder bumps |
| publishDate |
2019 |
| url |
https://scholarbank.nus.edu.sg/handle/10635/153885 |
| _version_ |
1821225202503122944 |