CHEMICAL MECHANICAL POLISHING PAD PROFILE OPTIMIZATION
Master's
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2019
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sg-nus-scholar.10635-1539782019-05-10T13:13:36Z CHEMICAL MECHANICAL POLISHING PAD PROFILE OPTIMIZATION KEN LI FUNG YUEN SINGAPORE-MIT ALLIANCE WONG CHEE CHEONG AHN KI CHEOL CMP polishing pad planarity pad profile conditioning pad balding wafer de-chuck retention time sweeping process optimization Master's MASTER OF SCIENCE IN ADVANCED MATERIALS FOR MICRO- & NANO- SYSTEMS 2019-05-10T05:32:00Z 2019-05-10T05:32:00Z 2007 Thesis KEN LI FUNG YUEN (2007). CHEMICAL MECHANICAL POLISHING PAD PROFILE OPTIMIZATION. ScholarBank@NUS Repository. https://scholarbank.nus.edu.sg/handle/10635/153978 SMA BATCHLOAD 20190422 |
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National University of Singapore |
building |
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Singapore |
collection |
ScholarBank@NUS |
topic |
CMP polishing pad planarity pad profile conditioning pad balding wafer de-chuck retention time sweeping process optimization |
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CMP polishing pad planarity pad profile conditioning pad balding wafer de-chuck retention time sweeping process optimization KEN LI FUNG YUEN CHEMICAL MECHANICAL POLISHING PAD PROFILE OPTIMIZATION |
description |
Master's |
author2 |
SINGAPORE-MIT ALLIANCE |
author_facet |
SINGAPORE-MIT ALLIANCE KEN LI FUNG YUEN |
format |
Theses and Dissertations |
author |
KEN LI FUNG YUEN |
author_sort |
KEN LI FUNG YUEN |
title |
CHEMICAL MECHANICAL POLISHING PAD PROFILE OPTIMIZATION |
title_short |
CHEMICAL MECHANICAL POLISHING PAD PROFILE OPTIMIZATION |
title_full |
CHEMICAL MECHANICAL POLISHING PAD PROFILE OPTIMIZATION |
title_fullStr |
CHEMICAL MECHANICAL POLISHING PAD PROFILE OPTIMIZATION |
title_full_unstemmed |
CHEMICAL MECHANICAL POLISHING PAD PROFILE OPTIMIZATION |
title_sort |
chemical mechanical polishing pad profile optimization |
publishDate |
2019 |
url |
https://scholarbank.nus.edu.sg/handle/10635/153978 |
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1681099323102724096 |