CARBON NANOTUBES AND APPLICATIONS IN IC PACKAGING
Master's
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sg-nus-scholar.10635-1541402019-05-15T13:15:06Z CARBON NANOTUBES AND APPLICATIONS IN IC PACKAGING CHEN XIAOYAN SINGAPORE-MIT ALLIANCE MARK HUANG Carbon nanotubes IC packaging nano-scale materials 1D materials growth method flip-chip solder joint reliability Master's MASTER OF SCIENCE 2019-05-15T04:18:44Z 2019-05-15T04:18:44Z 2007 Thesis CHEN XIAOYAN (2007). CARBON NANOTUBES AND APPLICATIONS IN IC PACKAGING. ScholarBank@NUS Repository. https://scholarbank.nus.edu.sg/handle/10635/154140 SMA BATCHLOAD 20190422 |
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Carbon nanotubes IC packaging nano-scale materials 1D materials growth method flip-chip solder joint reliability |
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Carbon nanotubes IC packaging nano-scale materials 1D materials growth method flip-chip solder joint reliability CHEN XIAOYAN CARBON NANOTUBES AND APPLICATIONS IN IC PACKAGING |
description |
Master's |
author2 |
SINGAPORE-MIT ALLIANCE |
author_facet |
SINGAPORE-MIT ALLIANCE CHEN XIAOYAN |
format |
Theses and Dissertations |
author |
CHEN XIAOYAN |
author_sort |
CHEN XIAOYAN |
title |
CARBON NANOTUBES AND APPLICATIONS IN IC PACKAGING |
title_short |
CARBON NANOTUBES AND APPLICATIONS IN IC PACKAGING |
title_full |
CARBON NANOTUBES AND APPLICATIONS IN IC PACKAGING |
title_fullStr |
CARBON NANOTUBES AND APPLICATIONS IN IC PACKAGING |
title_full_unstemmed |
CARBON NANOTUBES AND APPLICATIONS IN IC PACKAGING |
title_sort |
carbon nanotubes and applications in ic packaging |
publishDate |
2019 |
url |
https://scholarbank.nus.edu.sg/handle/10635/154140 |
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1681099343688368128 |