A NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES

Master's

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Bibliographic Details
Main Author:	XIONG ZHENGPENG
Other Authors:	MECHANICAL ENGINEERING
Format:	Theses and Dissertations
Published:	2019
Online Access:	https://scholarbank.nus.edu.sg/handle/10635/158676
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-158676
record_format	dspace
spelling	sg-nus-scholar.10635-1586762024-04-04T02:04:12Z A NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES XIONG ZHENGPENG MECHANICAL ENGINEERING ANDREW A.O. TAY Master's MASTER OF ENGINEERING 2019-09-16T02:34:33Z 2019-09-16T02:34:33Z 2001 Thesis XIONG ZHENGPENG (2001). A NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES. ScholarBank@NUS Repository. https://scholarbank.nus.edu.sg/handle/10635/158676 CCK BATCHLOAD 20190911
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	Master's
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING XIONG ZHENGPENG
format	Theses and Dissertations
author	XIONG ZHENGPENG
spellingShingle	XIONG ZHENGPENG A NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES
author_sort	XIONG ZHENGPENG
title	A NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES
title_short	A NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES
title_full	A NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES
title_fullStr	A NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES
title_full_unstemmed	A NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES
title_sort	numerical study of fracture in plastic ic packages
publishDate	2019
url	https://scholarbank.nus.edu.sg/handle/10635/158676
_version_	1800913729286569984

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