A NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES
Master's
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Main Author: | XIONG ZHENGPENG |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Theses and Dissertations |
Published: |
2019
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Online Access: | https://scholarbank.nus.edu.sg/handle/10635/158676 |
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Institution: | National University of Singapore |
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