Molecular Dynamics Simulation on the Influences of Nanostructure Shape, Interfacial Adhesion Energy, and Mold Insert Material on the Demolding Process of Micro-Injection Molding

• Main Authors: Yang, Jin, Weng, Can, Lai, Jun, Ding, Tao, Wang, Hao
• 其他作者: MECHANICAL ENGINEERING
• 格式: Article
• 語言: English
• 出版: MDPI 2020
• 主題: Science & Technology; Physical Sciences; Polymer Science; Interfacial adhesion energy; Nanostructured FeNi Films; Demolding; Micro-injection molding; WEIGHT DISPERSITY; SURFACE-TENSION; POLYMER; TEMPERATURE; NANOPILLARS; FABRICATION; COATINGS; FORCES
• 在線閱讀: https://scholarbank.nus.edu.sg/handle/10635/168558
• 機構: National University of Singapore

10.3390/polym11101573