Molecular Dynamics Simulation on the Influences of Nanostructure Shape, Interfacial Adhesion Energy, and Mold Insert Material on the Demolding Process of Micro-Injection Molding
10.3390/polym11101573
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Main Authors: | Yang, Jin, Weng, Can, Lai, Jun, Ding, Tao, Wang, Hao |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Article |
Language: | English |
Published: |
MDPI
2020
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Subjects: | |
Online Access: | https://scholarbank.nus.edu.sg/handle/10635/168558 |
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Institution: | National University of Singapore |
Language: | English |
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