Investigation of interface thermal resistance between polymer and mold insert in micro-injection molding by non-equilibrium molecular dynamics

Investigation of interface thermal resistance between polymer and mold insert in micro-injection molding by non-equilibrium molecular dynamics

10.3390/polym12102409

Saved in:
Bibliographic Details
Main Authors: Weng, C., Li, J., Lai, J., Liu, J., Wang, H.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: MDPI AG 2021
Subjects:
Interface thermal resistance
Micro-injection molding
Non-equilibrium molecular dynamics
Phonon density of state
Online Access:https://scholarbank.nus.edu.sg/handle/10635/197441
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore

Internet

https://scholarbank.nus.edu.sg/handle/10635/197441

Similar Items