Investigation of interface thermal resistance between polymer and mold insert in micro-injection molding by non-equilibrium molecular dynamics

10.3390/polym12102409

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Bibliographic Details
Main Authors:	Weng, C., Li, J., Lai, J., Liu, J., Wang, H.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	MDPI AG 2021
Subjects:	Interface thermal resistance Micro-injection molding Non-equilibrium molecular dynamics Phonon density of state
Online Access:	https://scholarbank.nus.edu.sg/handle/10635/197441
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-197441
record_format	dspace
spelling	sg-nus-scholar.10635-1974412024-04-04T02:07:27Z Investigation of interface thermal resistance between polymer and mold insert in micro-injection molding by non-equilibrium molecular dynamics Weng, C. Li, J. Lai, J. Liu, J. Wang, H. MECHANICAL ENGINEERING Interface thermal resistance Micro-injection molding Non-equilibrium molecular dynamics Phonon density of state 10.3390/polym12102409 Polymers 12 10 1-12 2021-08-18T02:49:26Z 2021-08-18T02:49:26Z 2020 Article Weng, C., Li, J., Lai, J., Liu, J., Wang, H. (2020). Investigation of interface thermal resistance between polymer and mold insert in micro-injection molding by non-equilibrium molecular dynamics. Polymers 12 (10) : 1-12. ScholarBank@NUS Repository. https://doi.org/10.3390/polym12102409 20734360 https://scholarbank.nus.edu.sg/handle/10635/197441 Attribution 4.0 International http://creativecommons.org/licenses/by/4.0/ MDPI AG Scopus OA2020
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Interface thermal resistance Micro-injection molding Non-equilibrium molecular dynamics Phonon density of state
spellingShingle	Interface thermal resistance Micro-injection molding Non-equilibrium molecular dynamics Phonon density of state Weng, C. Li, J. Lai, J. Liu, J. Wang, H. Investigation of interface thermal resistance between polymer and mold insert in micro-injection molding by non-equilibrium molecular dynamics
description	10.3390/polym12102409
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Weng, C. Li, J. Lai, J. Liu, J. Wang, H.
format	Article
author	Weng, C. Li, J. Lai, J. Liu, J. Wang, H.
author_sort	Weng, C.
title	Investigation of interface thermal resistance between polymer and mold insert in micro-injection molding by non-equilibrium molecular dynamics
title_short	Investigation of interface thermal resistance between polymer and mold insert in micro-injection molding by non-equilibrium molecular dynamics
title_full	Investigation of interface thermal resistance between polymer and mold insert in micro-injection molding by non-equilibrium molecular dynamics
title_fullStr	Investigation of interface thermal resistance between polymer and mold insert in micro-injection molding by non-equilibrium molecular dynamics
title_full_unstemmed	Investigation of interface thermal resistance between polymer and mold insert in micro-injection molding by non-equilibrium molecular dynamics
title_sort	investigation of interface thermal resistance between polymer and mold insert in micro-injection molding by non-equilibrium molecular dynamics
publisher	MDPI AG
publishDate	2021
url	https://scholarbank.nus.edu.sg/handle/10635/197441
_version_	1800914906110754816

Investigation of interface thermal resistance between polymer and mold insert in micro-injection molding by non-equilibrium molecular dynamics

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