Investigation of interface thermal resistance between polymer and mold insert in micro-injection molding by non-equilibrium molecular dynamics
10.3390/polym12102409
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Main Authors: | Weng, C., Li, J., Lai, J., Liu, J., Wang, H. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Article |
Published: |
MDPI AG
2021
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Subjects: | |
Online Access: | https://scholarbank.nus.edu.sg/handle/10635/197441 |
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Institution: | National University of Singapore |
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