Numerical simulation of interface delamination - with application to IC packaging

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Bibliographic Details
Main Author:	CHEONG WEE GEE
Other Authors:	MECHANICAL ENGINEERING
Format:	Theses and Dissertations
Language:	English
Published:	2010
Subjects:	Cell element model, IC packages, Interface delamination, Moisture Sensitivity Test, Vapor pressure, Void Growth
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/16915
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Institution:	National University of Singapore
Language:	English

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spelling	sg-nus-scholar.10635-169152017-10-21T07:37:56Z Numerical simulation of interface delamination - with application to IC packaging CHEONG WEE GEE MECHANICAL ENGINEERING CHENG LI Cell element model, IC packages, Interface delamination, Moisture Sensitivity Test, Vapor pressure, Void Growth Master's MASTER OF ENGINEERING 2010-05-13T19:10:28Z 2010-05-13T19:10:28Z 2005-03-15 Thesis CHEONG WEE GEE (2005-03-15). Numerical simulation of interface delamination - with application to IC packaging. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/16915 NOT_IN_WOS en
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
language	English
topic	Cell element model, IC packages, Interface delamination, Moisture Sensitivity Test, Vapor pressure, Void Growth
spellingShingle	Cell element model, IC packages, Interface delamination, Moisture Sensitivity Test, Vapor pressure, Void Growth CHEONG WEE GEE Numerical simulation of interface delamination - with application to IC packaging
description	Master's
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING CHEONG WEE GEE
format	Theses and Dissertations
author	CHEONG WEE GEE
author_sort	CHEONG WEE GEE
title	Numerical simulation of interface delamination - with application to IC packaging
title_short	Numerical simulation of interface delamination - with application to IC packaging
title_full	Numerical simulation of interface delamination - with application to IC packaging
title_fullStr	Numerical simulation of interface delamination - with application to IC packaging
title_full_unstemmed	Numerical simulation of interface delamination - with application to IC packaging
title_sort	numerical simulation of interface delamination - with application to ic packaging
publishDate	2010
url	http://scholarbank.nus.edu.sg/handle/10635/16915
_version_	1681079436223447040

Numerical simulation of interface delamination - with application to IC packaging

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