Board level drop testing of advanced IC packaging
Master's
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| Format: | Theses and Dissertations |
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2010
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| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/17004 |
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sg-nus-scholar.10635-170042024-10-25T14:40:25Z Board level drop testing of advanced IC packaging PEK WEE SONG, ERIC MECHANICAL ENGINEERING LIM CHWEE TECK TAN BENG CHYE, VINCENT Drop test, impact, IC packaging, board level, ball grid array (BGA), cyclic bending Master's MASTER OF ENGINEERING 2010-05-13T19:27:24Z 2010-05-13T19:27:24Z 2005-03-22 Thesis PEK WEE SONG, ERIC (2005-03-22). Board level drop testing of advanced IC packaging. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/17004 NOT_IN_WOS en |
| institution |
National University of Singapore |
| building |
NUS Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NUS Library |
| collection |
ScholarBank@NUS |
| language |
English |
| topic |
Drop test, impact, IC packaging, board level, ball grid array (BGA), cyclic bending |
| spellingShingle |
Drop test, impact, IC packaging, board level, ball grid array (BGA), cyclic bending PEK WEE SONG, ERIC Board level drop testing of advanced IC packaging |
| description |
Master's |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING PEK WEE SONG, ERIC |
| format |
Theses and Dissertations |
| author |
PEK WEE SONG, ERIC |
| author_sort |
PEK WEE SONG, ERIC |
| title |
Board level drop testing of advanced IC packaging |
| title_short |
Board level drop testing of advanced IC packaging |
| title_full |
Board level drop testing of advanced IC packaging |
| title_fullStr |
Board level drop testing of advanced IC packaging |
| title_full_unstemmed |
Board level drop testing of advanced IC packaging |
| title_sort |
board level drop testing of advanced ic packaging |
| publishDate |
2010 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/17004 |
| _version_ |
1821224649550200832 |