Board level drop testing of advanced IC packaging

Master's

Saved in:
Bibliographic Details
Main Author: PEK WEE SONG, ERIC
Other Authors: MECHANICAL ENGINEERING
Format: Theses and Dissertations
Language:English
Published: 2010
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/17004
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
Language: English

Similar Items