Low-power, low-pressure reactive-ion etching process for silicon etching with vertical and smooth walls for mechanobiology application

Low-power, low-pressure reactive-ion etching process for silicon etching with vertical and smooth walls for mechanobiology application

10.1117/1.JMM.16.3.034501

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Bibliographic Details
Main Authors: Ashraf, M, Sundararajan, S.V, Grenci, G
Other Authors: MECHANOBIOLOGY INSTITUTE
Format: Article
Published: 2020
Subjects:
Aspect ratio
Etching
Inductively coupled plasma
Ions
Lithography
Molds
Photoresists
Silicon oxides
Elastomeric materials
Etching process
Mechano-biology
Pattern transfers
Silicon etching
Silicon substrates
Soft-lithographic techniques
Vertical profile
Reactive ion etching
Online Access:https://scholarbank.nus.edu.sg/handle/10635/173783
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Institution: National University of Singapore

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https://scholarbank.nus.edu.sg/handle/10635/173783

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