Low-power, low-pressure reactive-ion etching process for silicon etching with vertical and smooth walls for mechanobiology application

10.1117/1.JMM.16.3.034501

Saved in:
Bibliographic Details
Main Authors: Ashraf, M, Sundararajan, S.V, Grenci, G
Other Authors: MECHANOBIOLOGY INSTITUTE
Format: Article
Published: 2020
Subjects:
Online Access:https://scholarbank.nus.edu.sg/handle/10635/173783
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
id sg-nus-scholar.10635-173783
record_format dspace
spelling sg-nus-scholar.10635-1737832023-10-31T21:51:07Z Low-power, low-pressure reactive-ion etching process for silicon etching with vertical and smooth walls for mechanobiology application Ashraf, M Sundararajan, S.V Grenci, G MECHANOBIOLOGY INSTITUTE Aspect ratio Etching Inductively coupled plasma Ions Lithography Molds Photoresists Silicon oxides Elastomeric materials Etching process Mechano-biology Pattern transfers Silicon etching Silicon substrates Soft-lithographic techniques Vertical profile Reactive ion etching 10.1117/1.JMM.16.3.034501 Journal of Micro/ Nanolithography, MEMS, and MOEMS 16 3 34501 2020-09-01T00:53:41Z 2020-09-01T00:53:41Z 2017 Article Ashraf, M, Sundararajan, S.V, Grenci, G (2017). Low-power, low-pressure reactive-ion etching process for silicon etching with vertical and smooth walls for mechanobiology application. Journal of Micro/ Nanolithography, MEMS, and MOEMS 16 (3) : 34501. ScholarBank@NUS Repository. https://doi.org/10.1117/1.JMM.16.3.034501 19325150 https://scholarbank.nus.edu.sg/handle/10635/173783 Unpaywall 20200831
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Aspect ratio
Etching
Inductively coupled plasma
Ions
Lithography
Molds
Photoresists
Silicon oxides
Elastomeric materials
Etching process
Mechano-biology
Pattern transfers
Silicon etching
Silicon substrates
Soft-lithographic techniques
Vertical profile
Reactive ion etching
spellingShingle Aspect ratio
Etching
Inductively coupled plasma
Ions
Lithography
Molds
Photoresists
Silicon oxides
Elastomeric materials
Etching process
Mechano-biology
Pattern transfers
Silicon etching
Silicon substrates
Soft-lithographic techniques
Vertical profile
Reactive ion etching
Ashraf, M
Sundararajan, S.V
Grenci, G
Low-power, low-pressure reactive-ion etching process for silicon etching with vertical and smooth walls for mechanobiology application
description 10.1117/1.JMM.16.3.034501
author2 MECHANOBIOLOGY INSTITUTE
author_facet MECHANOBIOLOGY INSTITUTE
Ashraf, M
Sundararajan, S.V
Grenci, G
format Article
author Ashraf, M
Sundararajan, S.V
Grenci, G
author_sort Ashraf, M
title Low-power, low-pressure reactive-ion etching process for silicon etching with vertical and smooth walls for mechanobiology application
title_short Low-power, low-pressure reactive-ion etching process for silicon etching with vertical and smooth walls for mechanobiology application
title_full Low-power, low-pressure reactive-ion etching process for silicon etching with vertical and smooth walls for mechanobiology application
title_fullStr Low-power, low-pressure reactive-ion etching process for silicon etching with vertical and smooth walls for mechanobiology application
title_full_unstemmed Low-power, low-pressure reactive-ion etching process for silicon etching with vertical and smooth walls for mechanobiology application
title_sort low-power, low-pressure reactive-ion etching process for silicon etching with vertical and smooth walls for mechanobiology application
publishDate 2020
url https://scholarbank.nus.edu.sg/handle/10635/173783
_version_ 1781792153015418880