All WSe2 1T1R resistive RAM cell for future monolithic 3D embedded memory integration

10.1038/s41467-019-13176-4

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Bibliographic Details
Main Author: THEAN VOON YEW, AARON
Other Authors: ELECTRICAL AND COMPUTER ENGINEERING
Format: Article
Published: Nature 2020
Online Access:https://scholarbank.nus.edu.sg/handle/10635/176223
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Institution: National University of Singapore