PACKAGE CRACKING MECHANISM IN PLASTIC ENCAPSULATED INTEGRATED CIRCUIT DEVICES
Master's
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| Main Author: | |
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| Format: | Theses and Dissertations |
| Published: |
2020
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| Online Access: | https://scholarbank.nus.edu.sg/handle/10635/179324 |
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| Institution: | National University of Singapore |
| Summary: | Master's |
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