PACKAGE CRACKING MECHANISM IN PLASTIC ENCAPSULATED INTEGRATED CIRCUIT DEVICES
Master's
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| Format: | Theses and Dissertations |
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2020
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| Online Access: | https://scholarbank.nus.edu.sg/handle/10635/179324 |
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sg-nus-scholar.10635-1793242020-11-19T13:57:28Z PACKAGE CRACKING MECHANISM IN PLASTIC ENCAPSULATED INTEGRATED CIRCUIT DEVICES TAN GEOK LEONG MECHANICAL & PRODUCTION ENGINEERING A.O.TAY Master's MASTER OF ENGINEERING 2020-10-23T03:21:00Z 2020-10-23T03:21:00Z 1993 Thesis TAN GEOK LEONG (1993). PACKAGE CRACKING MECHANISM IN PLASTIC ENCAPSULATED INTEGRATED CIRCUIT DEVICES. ScholarBank@NUS Repository. https://scholarbank.nus.edu.sg/handle/10635/179324 CCK BATCHLOAD 20201023 |
| institution |
National University of Singapore |
| building |
NUS Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NUS Library |
| collection |
ScholarBank@NUS |
| description |
Master's |
| author2 |
MECHANICAL & PRODUCTION ENGINEERING |
| author_facet |
MECHANICAL & PRODUCTION ENGINEERING TAN GEOK LEONG |
| format |
Theses and Dissertations |
| author |
TAN GEOK LEONG |
| spellingShingle |
TAN GEOK LEONG PACKAGE CRACKING MECHANISM IN PLASTIC ENCAPSULATED INTEGRATED CIRCUIT DEVICES |
| author_sort |
TAN GEOK LEONG |
| title |
PACKAGE CRACKING MECHANISM IN PLASTIC ENCAPSULATED INTEGRATED CIRCUIT DEVICES |
| title_short |
PACKAGE CRACKING MECHANISM IN PLASTIC ENCAPSULATED INTEGRATED CIRCUIT DEVICES |
| title_full |
PACKAGE CRACKING MECHANISM IN PLASTIC ENCAPSULATED INTEGRATED CIRCUIT DEVICES |
| title_fullStr |
PACKAGE CRACKING MECHANISM IN PLASTIC ENCAPSULATED INTEGRATED CIRCUIT DEVICES |
| title_full_unstemmed |
PACKAGE CRACKING MECHANISM IN PLASTIC ENCAPSULATED INTEGRATED CIRCUIT DEVICES |
| title_sort |
package cracking mechanism in plastic encapsulated integrated circuit devices |
| publishDate |
2020 |
| url |
https://scholarbank.nus.edu.sg/handle/10635/179324 |
| _version_ |
1686109052127412224 |