PACKAGE CRACKING MECHANISM IN PLASTIC ENCAPSULATED INTEGRATED CIRCUIT DEVICES

Master's

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Bibliographic Details
Main Author: TAN GEOK LEONG
Other Authors: MECHANICAL & PRODUCTION ENGINEERING
Format: Theses and Dissertations
Published: 2020
Online Access:https://scholarbank.nus.edu.sg/handle/10635/179324
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Institution: National University of Singapore

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