PACKAGE CRACKING MECHANISM IN PLASTIC ENCAPSULATED INTEGRATED CIRCUIT DEVICES
Master's
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Main Author: | TAN GEOK LEONG |
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Other Authors: | MECHANICAL & PRODUCTION ENGINEERING |
Format: | Theses and Dissertations |
Published: |
2020
|
Online Access: | https://scholarbank.nus.edu.sg/handle/10635/179324 |
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Institution: | National University of Singapore |
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