The effect of moisture on the critical defect size for delamination failure at the pad/encapsulant interface of plastic IC packages undergoing solder reflow
10.1109/ICEPT.2005.1564737
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| Main Authors: | , , |
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| Other Authors: | |
| Format: | Conference or Workshop Item |
| Published: |
2014
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| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/51655 |
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| Institution: | National University of Singapore |