The effect of moisture on the critical defect size for delamination failure at the pad/encapsulant interface of plastic IC packages undergoing solder reflow

10.1109/ICEPT.2005.1564737

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Bibliographic Details
Main Authors:	Tay, A.A.O., Ma, Y.Y., Hu, G.J.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/51655
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Institution:	National University of Singapore

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spelling	sg-nus-scholar.10635-516552015-01-10T03:15:00Z The effect of moisture on the critical defect size for delamination failure at the pad/encapsulant interface of plastic IC packages undergoing solder reflow Tay, A.A.O. Ma, Y.Y. Hu, G.J. MECHANICAL ENGINEERING MECHANICAL & PRODUCTION ENGINEERING 10.1109/ICEPT.2005.1564737 2005 6th International Conference on Electronics Packaging Technology 2005 - 2014-04-24T10:18:00Z 2014-04-24T10:18:00Z 2005 Conference Paper Tay, A.A.O.,Ma, Y.Y.,Hu, G.J. (2005). The effect of moisture on the critical defect size for delamination failure at the pad/encapsulant interface of plastic IC packages undergoing solder reflow. 2005 6th International Conference on Electronics Packaging Technology 2005 : -. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/ICEPT.2005.1564737" target="_blank">https://doi.org/10.1109/ICEPT.2005.1564737</a> 0780394496 http://scholarbank.nus.edu.sg/handle/10635/51655 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	10.1109/ICEPT.2005.1564737
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Tay, A.A.O. Ma, Y.Y. Hu, G.J.
format	Conference or Workshop Item
author	Tay, A.A.O. Ma, Y.Y. Hu, G.J.
spellingShingle	Tay, A.A.O. Ma, Y.Y. Hu, G.J. The effect of moisture on the critical defect size for delamination failure at the pad/encapsulant interface of plastic IC packages undergoing solder reflow
author_sort	Tay, A.A.O.
title	The effect of moisture on the critical defect size for delamination failure at the pad/encapsulant interface of plastic IC packages undergoing solder reflow
title_short	The effect of moisture on the critical defect size for delamination failure at the pad/encapsulant interface of plastic IC packages undergoing solder reflow
title_full	The effect of moisture on the critical defect size for delamination failure at the pad/encapsulant interface of plastic IC packages undergoing solder reflow
title_fullStr	The effect of moisture on the critical defect size for delamination failure at the pad/encapsulant interface of plastic IC packages undergoing solder reflow
title_full_unstemmed	The effect of moisture on the critical defect size for delamination failure at the pad/encapsulant interface of plastic IC packages undergoing solder reflow
title_sort	effect of moisture on the critical defect size for delamination failure at the pad/encapsulant interface of plastic ic packages undergoing solder reflow
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/51655
_version_	1681083885972094976

The effect of moisture on the critical defect size for delamination failure at the pad/encapsulant interface of plastic IC packages undergoing solder reflow

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