The effect of moisture on the critical defect size for delamination failure at the pad/encapsulant interface of plastic IC packages undergoing solder reflow

• Main Authors: Tay, A.A.O., Ma, Y.Y., Hu, G.J.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/51655
• Institution: National University of Singapore

10.1109/ICEPT.2005.1564737