Two planar polishing methods by using FIB technique: Toward ultimate top-down delayering for failure analysis
10.1063/1.4936941
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sg-nus-scholar.10635-1837372024-04-17T03:19:57Z Two planar polishing methods by using FIB technique: Toward ultimate top-down delayering for failure analysis Wang, D.D Huang, Y.M Tan, P.K Feng, H Low, G.R Yap, H.H He, R Tan, H Dawood, M.K Zhao, Y.Z Lam, J Mai, Z.H ELECTRICAL AND COMPUTER ENGINEERING Failure analysis Image segmentation Ion beams Semiconductor device manufacture Capture images Chemical etching Focused ion beam technique High-precision Layer peeling Region of interest Semiconductor manufacturing process Technology improvement Polishing 10.1063/1.4936941 AIP Advances 5 12 127101 2020-11-19T09:41:29Z 2020-11-19T09:41:29Z 2015 Article Wang, D.D, Huang, Y.M, Tan, P.K, Feng, H, Low, G.R, Yap, H.H, He, R, Tan, H, Dawood, M.K, Zhao, Y.Z, Lam, J, Mai, Z.H (2015). Two planar polishing methods by using FIB technique: Toward ultimate top-down delayering for failure analysis. AIP Advances 5 (12) : 127101. ScholarBank@NUS Repository. https://doi.org/10.1063/1.4936941 21583226 https://scholarbank.nus.edu.sg/handle/10635/183737 Attribution 4.0 International http://creativecommons.org/licenses/by/4.0/ Unpaywall 20201031 |
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Asia |
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Singapore Singapore |
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Failure analysis Image segmentation Ion beams Semiconductor device manufacture Capture images Chemical etching Focused ion beam technique High-precision Layer peeling Region of interest Semiconductor manufacturing process Technology improvement Polishing |
| spellingShingle |
Failure analysis Image segmentation Ion beams Semiconductor device manufacture Capture images Chemical etching Focused ion beam technique High-precision Layer peeling Region of interest Semiconductor manufacturing process Technology improvement Polishing Wang, D.D Huang, Y.M Tan, P.K Feng, H Low, G.R Yap, H.H He, R Tan, H Dawood, M.K Zhao, Y.Z Lam, J Mai, Z.H Two planar polishing methods by using FIB technique: Toward ultimate top-down delayering for failure analysis |
| description |
10.1063/1.4936941 |
| author2 |
ELECTRICAL AND COMPUTER ENGINEERING |
| author_facet |
ELECTRICAL AND COMPUTER ENGINEERING Wang, D.D Huang, Y.M Tan, P.K Feng, H Low, G.R Yap, H.H He, R Tan, H Dawood, M.K Zhao, Y.Z Lam, J Mai, Z.H |
| format |
Article |
| author |
Wang, D.D Huang, Y.M Tan, P.K Feng, H Low, G.R Yap, H.H He, R Tan, H Dawood, M.K Zhao, Y.Z Lam, J Mai, Z.H |
| author_sort |
Wang, D.D |
| title |
Two planar polishing methods by using FIB technique: Toward ultimate top-down delayering for failure analysis |
| title_short |
Two planar polishing methods by using FIB technique: Toward ultimate top-down delayering for failure analysis |
| title_full |
Two planar polishing methods by using FIB technique: Toward ultimate top-down delayering for failure analysis |
| title_fullStr |
Two planar polishing methods by using FIB technique: Toward ultimate top-down delayering for failure analysis |
| title_full_unstemmed |
Two planar polishing methods by using FIB technique: Toward ultimate top-down delayering for failure analysis |
| title_sort |
two planar polishing methods by using fib technique: toward ultimate top-down delayering for failure analysis |
| publishDate |
2020 |
| url |
https://scholarbank.nus.edu.sg/handle/10635/183737 |
| _version_ |
1800914720549502976 |