Two planar polishing methods by using FIB technique: Toward ultimate top-down delayering for failure analysis

Two planar polishing methods by using FIB technique: Toward ultimate top-down delayering for failure analysis

10.1063/1.4936941

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Bibliographic Details
Main Authors: Wang, D.D, Huang, Y.M, Tan, P.K, Feng, H, Low, G.R, Yap, H.H, He, R, Tan, H, Dawood, M.K, Zhao, Y.Z, Lam, J, Mai, Z.H
Other Authors: ELECTRICAL AND COMPUTER ENGINEERING
Format: Article
Published: 2020
Subjects:
Failure analysis
Image segmentation
Ion beams
Semiconductor device manufacture
Capture images
Chemical etching
Focused ion beam technique
High-precision
Layer peeling
Region of interest
Semiconductor manufacturing process
Technology improvement
Polishing
Online Access:https://scholarbank.nus.edu.sg/handle/10635/183737
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Institution: National University of Singapore

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https://scholarbank.nus.edu.sg/handle/10635/183737

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