Two planar polishing methods by using FIB technique: Toward ultimate top-down delayering for failure analysis

• Main Authors: Wang, D.D, Huang, Y.M, Tan, P.K, Feng, H, Low, G.R, Yap, H.H, He, R, Tan, H, Dawood, M.K, Zhao, Y.Z, Lam, J, Mai, Z.H
• 其他作者: ELECTRICAL AND COMPUTER ENGINEERING
• 格式: Article
• 出版: 2020
• 主題: Failure analysis; Image segmentation; Ion beams; Semiconductor device manufacture; Capture images; Chemical etching; Focused ion beam technique; High-precision; Layer peeling; Region of interest; Semiconductor manufacturing process; Technology improvement; Polishing
• 在線閱讀: https://scholarbank.nus.edu.sg/handle/10635/183737

10.1063/1.4936941