Illumination System Modeling Techniques in Wire Bonding Pattern Recognition System
10.1109/icept.2006.359814
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sg-nus-scholar.10635-1859032021-01-28T13:15:32Z Illumination System Modeling Techniques in Wire Bonding Pattern Recognition System Yong, Wayne Jin, Cai Xiao Ho, Hong Meng INSTITUTE OF MICROELECTRONICS illumination model illumination calibration lighting calibration Vision system machine vision 10.1109/icept.2006.359814 2006 7th International Conference on Electronic Packaging Technology 2021-01-28T01:12:49Z 2021-01-28T01:12:49Z 2006-08 2021-01-27T11:32:48Z Conference Paper Yong, Wayne, Jin, Cai Xiao, Ho, Hong Meng (2006-08). Illumination System Modeling Techniques in Wire Bonding Pattern Recognition System. 2006 7th International Conference on Electronic Packaging Technology. ScholarBank@NUS Repository. https://doi.org/10.1109/icept.2006.359814 142440620X 9781424406203 https://scholarbank.nus.edu.sg/handle/10635/185903 IEEE Elements |
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illumination model illumination calibration lighting calibration Vision system machine vision |
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illumination model illumination calibration lighting calibration Vision system machine vision Yong, Wayne Jin, Cai Xiao Ho, Hong Meng Illumination System Modeling Techniques in Wire Bonding Pattern Recognition System |
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10.1109/icept.2006.359814 |
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INSTITUTE OF MICROELECTRONICS |
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INSTITUTE OF MICROELECTRONICS Yong, Wayne Jin, Cai Xiao Ho, Hong Meng |
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Conference or Workshop Item |
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Yong, Wayne Jin, Cai Xiao Ho, Hong Meng |
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Yong, Wayne |
title |
Illumination System Modeling Techniques in Wire Bonding Pattern Recognition System |
title_short |
Illumination System Modeling Techniques in Wire Bonding Pattern Recognition System |
title_full |
Illumination System Modeling Techniques in Wire Bonding Pattern Recognition System |
title_fullStr |
Illumination System Modeling Techniques in Wire Bonding Pattern Recognition System |
title_full_unstemmed |
Illumination System Modeling Techniques in Wire Bonding Pattern Recognition System |
title_sort |
illumination system modeling techniques in wire bonding pattern recognition system |
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IEEE |
publishDate |
2021 |
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https://scholarbank.nus.edu.sg/handle/10635/185903 |
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