Envelope thermal performance analysis based on building information model (BIM) cloud platform - Proposed green mark collaboration environment

10.3390/en13030586

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Bibliographic Details
Main Authors:	Liu, Z., Wang, Q., Gan, V.J.L., Peh, L.
Other Authors:	BUILDING
Format:	Article
Published:	MDPI AG 2021
Subjects:	Building Information Modeling Cloud-based Envelope thermal performance Green buildings Green Mark Integrated Digital Delivery (IDD)
Online Access:	https://scholarbank.nus.edu.sg/handle/10635/198630
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-198630
record_format	dspace
spelling	sg-nus-scholar.10635-1986302024-11-10T20:11:38Z Envelope thermal performance analysis based on building information model (BIM) cloud platform - Proposed green mark collaboration environment Liu, Z. Wang, Q. Gan, V.J.L. Peh, L. BUILDING Building Information Modeling Cloud-based Envelope thermal performance Green buildings Green Mark Integrated Digital Delivery (IDD) 10.3390/en13030586 Energies 13 3 586 2021-08-23T03:14:47Z 2021-08-23T03:14:47Z 2020-01-27 Article Liu, Z., Wang, Q., Gan, V.J.L., Peh, L. (2020-01-27). Envelope thermal performance analysis based on building information model (BIM) cloud platform - Proposed green mark collaboration environment. Energies 13 (3) : 586. ScholarBank@NUS Repository. https://doi.org/10.3390/en13030586 19961073 https://scholarbank.nus.edu.sg/handle/10635/198630 Attribution 4.0 International http://creativecommons.org/licenses/by/4.0/ MDPI AG Scopus OA2020
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Building Information Modeling Cloud-based Envelope thermal performance Green buildings Green Mark Integrated Digital Delivery (IDD)
spellingShingle	Building Information Modeling Cloud-based Envelope thermal performance Green buildings Green Mark Integrated Digital Delivery (IDD) Liu, Z. Wang, Q. Gan, V.J.L. Peh, L. Envelope thermal performance analysis based on building information model (BIM) cloud platform - Proposed green mark collaboration environment
description	10.3390/en13030586
author2	BUILDING
author_facet	BUILDING Liu, Z. Wang, Q. Gan, V.J.L. Peh, L.
format	Article
author	Liu, Z. Wang, Q. Gan, V.J.L. Peh, L.
author_sort	Liu, Z.
title	Envelope thermal performance analysis based on building information model (BIM) cloud platform - Proposed green mark collaboration environment
title_short	Envelope thermal performance analysis based on building information model (BIM) cloud platform - Proposed green mark collaboration environment
title_full	Envelope thermal performance analysis based on building information model (BIM) cloud platform - Proposed green mark collaboration environment
title_fullStr	Envelope thermal performance analysis based on building information model (BIM) cloud platform - Proposed green mark collaboration environment
title_full_unstemmed	Envelope thermal performance analysis based on building information model (BIM) cloud platform - Proposed green mark collaboration environment
title_sort	envelope thermal performance analysis based on building information model (bim) cloud platform - proposed green mark collaboration environment
publisher	MDPI AG
publishDate	2021
url	https://scholarbank.nus.edu.sg/handle/10635/198630
_version_	1821231678447681536

Envelope thermal performance analysis based on building information model (BIM) cloud platform - Proposed green mark collaboration environment

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