Envelope thermal performance analysis based on building information model (BIM) cloud platform - Proposed green mark collaboration environment
10.3390/en13030586
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| Main Authors: | , , , |
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| Other Authors: | |
| Format: | Article |
| Published: |
MDPI AG
2021
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| Subjects: | |
| Online Access: | https://scholarbank.nus.edu.sg/handle/10635/198630 |
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| Institution: | National University of Singapore |