Envelope thermal performance analysis based on building information model (BIM) cloud platform - Proposed green mark collaboration environment

Envelope thermal performance analysis based on building information model (BIM) cloud platform - Proposed green mark collaboration environment

10.3390/en13030586

Saved in:
Bibliographic Details
Main Authors: Liu, Z., Wang, Q., Gan, V.J.L., Peh, L.
Other Authors: BUILDING
Format: Article
Published: MDPI AG 2021
Subjects:
Building Information Modeling
Cloud-based
Envelope thermal performance
Green buildings
Green Mark
Integrated Digital Delivery (IDD)
Online Access:https://scholarbank.nus.edu.sg/handle/10635/198630
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore

Internet

https://scholarbank.nus.edu.sg/handle/10635/198630

Similar Items