Boosting contact sliding and wear protection via atomic intermixing and tailoring of nanoscale interfaces

Boosting contact sliding and wear protection via atomic intermixing and tailoring of nanoscale interfaces

10.1126/sciadv.aau7886

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Bibliographic Details
Main Authors: Dwivedi, N., Yeo, R.J., Dhand, C., Risan, J., Nay, R., Tripathy, S., Rajauria, S., Saifullah, M.S.M., Sankaranarayanan, S.K.R.S., Yang, H., Danner, A., Bhatia, C.S.
Other Authors: ELECTRICAL AND COMPUTER ENGINEERING
Format: Article
Published: American Association for the Advancement of Science 2021
Online Access:https://scholarbank.nus.edu.sg/handle/10635/210807
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Institution: National University of Singapore

Internet

https://scholarbank.nus.edu.sg/handle/10635/210807

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