A Theoretical and Numerical study of crack propagation along a bimaterial interface with application to IC Packaging

Ph.D

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Bibliographic Details
Main Author:	HU GUOJUN
Other Authors:	MECHANICAL ENGINEERING
Format:	Theses and Dissertations
Language:	English
Published:	2011
Subjects:	MCSDEM; MVCCM; interface delamination; IC packaging
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/23215
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Institution:	National University of Singapore
Language:	English

id	sg-nus-scholar.10635-23215
record_format	dspace
spelling	sg-nus-scholar.10635-232152017-10-21T09:02:44Z A Theoretical and Numerical study of crack propagation along a bimaterial interface with application to IC Packaging HU GUOJUN MECHANICAL ENGINEERING TAY AH ONG, ANDREW ZHANG YONG-WEI MCSDEM; MVCCM; interface delamination; IC packaging Ph.D DOCTOR OF PHILOSOPHY 2011-06-10T18:04:31Z 2011-06-10T18:04:31Z 2007-06-06 Thesis HU GUOJUN (2007-06-06). A Theoretical and Numerical study of crack propagation along a bimaterial interface with application to IC Packaging. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/23215 NOT_IN_WOS en
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
language	English
topic	MCSDEM; MVCCM; interface delamination; IC packaging
spellingShingle	MCSDEM; MVCCM; interface delamination; IC packaging HU GUOJUN A Theoretical and Numerical study of crack propagation along a bimaterial interface with application to IC Packaging
description	Ph.D
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING HU GUOJUN
format	Theses and Dissertations
author	HU GUOJUN
author_sort	HU GUOJUN
title	A Theoretical and Numerical study of crack propagation along a bimaterial interface with application to IC Packaging
title_short	A Theoretical and Numerical study of crack propagation along a bimaterial interface with application to IC Packaging
title_full	A Theoretical and Numerical study of crack propagation along a bimaterial interface with application to IC Packaging
title_fullStr	A Theoretical and Numerical study of crack propagation along a bimaterial interface with application to IC Packaging
title_full_unstemmed	A Theoretical and Numerical study of crack propagation along a bimaterial interface with application to IC Packaging
title_sort	theoretical and numerical study of crack propagation along a bimaterial interface with application to ic packaging
publishDate	2011
url	http://scholarbank.nus.edu.sg/handle/10635/23215
_version_	1681080030800642048

A Theoretical and Numerical study of crack propagation along a bimaterial interface with application to IC Packaging

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