Electroless copper deposition and interface characteristics of ionic electroactive polymer

Electroless copper deposition and interface characteristics of ionic electroactive polymer

10.1016/j.jmrt.2021.01.062

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Bibliographic Details
Main Authors: Yang, Liang, Zhang, Dongsheng, Zhang, Xining, Tian, Aifen
Other Authors: CIVIL ENGINEERING
Format: Article
Published: Elsevier Editora Ltda 2022
Subjects:
Chemical deposition
Interface
IPMC
Weierstrass-Mandelbrot function
Online Access:https://scholarbank.nus.edu.sg/handle/10635/232504
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Institution: National University of Singapore

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https://scholarbank.nus.edu.sg/handle/10635/232504

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