Electroless copper deposition and interface characteristics of ionic electroactive polymer
10.1016/j.jmrt.2021.01.062
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| Main Authors: | , , , |
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| Other Authors: | |
| Format: | Article |
| Published: |
Elsevier Editora Ltda
2022
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| Subjects: | |
| Online Access: | https://scholarbank.nus.edu.sg/handle/10635/232504 |
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| Institution: | National University of Singapore |